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Priority Packaging, Inc. 13650 TI BLVD, Suite 202 Category: Semiconductors and Related Devices Manufacturers
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Company representatives
Phone: (469) 916-1393
Email: moc.gkpytiroirp@nannerdm
Rhonda Drennan, Vice President
Phone: (469) 916-1393
Email: moc.gkpytiroirp@adnohr
About Priority Packaging, Inc.
Integrated Circuit Prototype assembly and IC repackaging.
We perform the following engineering services:
Wafer Saw, Laser Symbollization, IC Bonding, IC repackaging, Cross Sectioning, MCM Assembly, BGA Reball
Products and Services
- IC Prototype Assembly
- IC Repackaging
Location Type
Headquarters
Revenue
$1,500,000 - $1,750,000
Employees
5 to 9
Years In Business
18
Memberships
- ISTFA
Additional information
We have developed significant IP to support the repackaging of high pin count integrated circuits and integrated circuits utilizing wafer chip scale packaging.
Rating
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